1.5W/m·K thermal pad with soft high-rebound performance for battery packs and electronics.
1.5W/m·K thermal pad with soft high-rebound performance for battery packs and electronics.
| Thermal Conductivity | 1.5 W/m·K |
|---|---|
| Thickness | 0.5 - 10 mm |
| Hardness | Shore 00 30-50 |
| Dielectric Strength | ≥ 6 kV/mm |
| Operating Temperature | -40°C ~ 200°C |
For the full datasheet or volume pricing, please send an inquiry.
Based on silicone with thermally conductive fillers, the pad offers excellent compression recovery, filling air gaps between heat sources and heat sinks to reduce interfacial thermal resistance.
| Parameter | Value |
|---|---|
| Thermal Conductivity | 1.5 W/m·K |
| Thickness | 0.5 - 10 mm |
| Hardness | Shore 00 30-50 |
| Dielectric Strength | ≥ 6 kV/mm |
| Operating Temperature | -40°C ~ 200°C |
| Flame Rating | UL94 V-0 |
| Size | 可模切定制 / Custom die-cut |
Battery pack cooling, power modules, LED drivers, telecom equipment
Fast prototyping, OEM/ODM customization, volume supply and full export certification support. Voltage, capacity, dimensions and BMS functions can be customized on request.
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